Fundamentals of Material Processing II. Instructor: Prof. Shashank Shekhar and Prof. Anshu Gaur, Department of Materials Science and Engineering, IIT Kanpur. The aim of the course is to acquaint students with the fundamentals involved in the processing of materials. Various materials processes are used in variety of industries to create and form materials for wide range of applications. There are some commonalities behind all these processes and the aim of this course is to go through these fundamental physics and materials science behind these processes so as to be able to understand, design and predict the outcome of these methods. At the end of this course, students should be able to answer the following questions: (a) What are the various fundamental material processing techniques and the science behind it; (b) What processing method to use for a given material and a given application. This course is offered in two parts of 20 hours each. First part of the course deals with Solidification and Powder Metallurgy, while the second part deals with Metal processing and Thin film deposition.
(from nptel.ac.in)
Lecture 30 - Sputtering (cont.)
This lecture contains following topics: 1) Sputtering targets and their Characteristics, 2) Reactive sputtering of Oxides, Nitrides, Carbides, Sulphides etc. 3) Magnetron Sputtering: Combined effect of electric and magnetic field on charged species, 4) Different Magnetron designs: (a) Planer Magnetron; (b) Cylindrical-Post Magnetron; (c) Sputter-gun geometry, 5) Industrial Sputtering: Large area deposition scale, 6) Capacitively coupled Plasma and Inductively coupled Plasma.