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An Introduction to Electronics Systems Packaging

An Introduction to Electronics Systems Packaging. Instructor: Prof. G. V. Mahesh, Department of Electronic Systems Engineering, IISc Bangalore. The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging. The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level. The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered. (from nptel.ac.in)

Lecture 29 - Solder Mask for PWBs; Multilayer PWBs; Introduction to Microvias


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Overview of Electronic Systems Packaging
Lecture 01 - Introduction and Objectives of the Course
Lecture 02 - Definition of a System and History of Semiconductors
Lecture 03 - Products and Levels of Packaging
Lecture 04 - Packaging Aspects of Handheld Products; Case Studies in Applications
Lecture 05 - Case Studies (cont.), Definition of PWB, Summary and Questions for Review
Semiconductor Packaging Overview
Lecture 06 - Basic of Semiconductor and Process Flowchart
Lecture 07 - Wafer Fabrication, Inspection and Testing
Lecture 08 - Wafer Packaging; Packaging Evolution; Chip Connection Choices
Lecture 09 - Wire Bonding, TAB and Flip Chip
Lecture 10 - Wire Bonding, TAB and Flip Chip (cont.)
Semiconductor Packages
Lecture 11 - Why Packaging? and Single Chip Packages or Modules (SCM)
Lecture 12 - Commonly Used Packages and Advanced Packages; Materials in Packages
Lecture 13 - Advanced Packages; Thermal Mismatch in Packages; Current Trends in Packaging
Lecture 14 - Multichip Modules Types; System-In-Package; Packaging Roadmaps; Hybrid Circuits
Electrical Design Considerations in Systems Packaging
Lecture 15 - Electrical Issues: Resistive Parasitic
Lecture 16 - Electrical Issues: Capacitive and Inductive Parasitic
Lecture 17 - Electrical Issues: Layout Guidelines and the Reflection Problem
Lecture 18 - Electrical Issues: Interconnection
CAD for Printed Wiring Boards
Lecture 19 - Quick Tutorial on Packages; Benefits from CAD; Introduction to DFM, DFR and DFT
Lecture 20 - Components of a CAD Package and its Highlights
Lecture 21 - Design Flow Considerations; Beginning a Circuit Design with Schematic Work and Component Layout
Lecture 22 - Demo and Examples of Layout and Routing; Technology File Generation from CAD
Printed Wiring Board Technologies: Board-Level Packaging Aspects
Lecture 23 - Review of CAD Output Files for PCB Fabrication; Photoplotting and Mask Generation
Lecture 24 - Process Flow-Chart; Vias; PWB Substrates
Lecture 25 - Substrates (cont.); Surface Preparation
Lecture 26 - Photoresist and Application Methods; UV Exposure and Developing; Printing Technologies for PWBs
Lecture 27 - PWB Etching; Resist Stripping; Screen Printing Technology
Lecture 28 - Through-hole Manufacture Process Steps; Panel and Pattern Plating Methods
Lecture 29 - Solder Mask for PWBs; Multilayer PWBs; Introduction to Microvias
Lecture 30 - Microvia Technology and Sequential Build-Up Technology Process Flow for High-Density Interconnects
Lecture 31 - Conventional vs HDI Technologies; Flexible Circuits
Surface Mount Technology
Lecture 32 - SMD Benefits; Design Issues; Introduction to Soldering
Lecture 33 - Reflow and Wave Soldering Methods to Attach SMDs
Lecture 34 - Solders; Wetting of Solders; Flux and its Properties; Defects in Wave Soldering
Lecture 35 - Vapour Phase Soldering; BGA Soldering and Desoldering Repair; SMT Failures
Lecture 36 - SMT Failure Library and Tin Whiskers
Lecture 37 - Tin-lead and Lead-free Solders; Phase Diagrams; Thermal Profiles for Reflow Soldering; Lead-free Alloys
Lecture 38 - Lead-free Solder Considerations; Green Electronics; RoHS Compliance and E-waste Recycling Issues
Thermal Design Considerations in System Packaging
Lecture 39 - Thermal Design Considerations in System Packaging
Embedded Passives Technology
Lecture 40 - Introduction to Embedded Passives; Need for Embedded Passives; Design Library; Embedded Resistor Processes
Lecture 41 - Embedded Capacitors; Processes for Embedding Capacitors
Conclusion and Summary
Lecture 42 - Exclusive Chapter Wise Summary