Electrical Engineering 143: Microfabrication Technology
Electrical Engineering 143: Microfabrication Technology (Fall 2014, UC Berkeley). Instructor: Professor Clark Tu-cuong Nguyen. Microfabrication Technology - Integrated circuit device fabrication and surface micromachining technology.
Thermal oxidation, ion implantation, impurity diffusion, film deposition, epitaxy, lithography, etching, contacts and interconnections, and process integration issues. Device design and mask layout, relation between physical structure and
electrical/mechanical performance. MOS transistors and poly-Si surface microstructures will be fabricated in the laboratory and evaluated.
| Lecture 10 - Oxidation: Theory, Graphs |
|
| Time |
Lecture Chapters |
| [00:00:00] |
1. Oxidation Theory |
| [01:15:10] |
2. Oxidation Graphs |
Go to the Course Home or watch other lectures:
| Lecture 05 - Process Module Overview, Process Integration: NMOS Process |
| Lecture 06 - Process Integration: Example NMOS Process, Masks and Alignment |
| Lecture 07 - Masks and Alignment, Four Main Components of Lithography |
| Lecture 08 - Lithography: Masks and Alignment, Design Rules, Resolution |
| Lecture 09 - Lithography: Resolution, Linewidth Control/ Thermal Oxidation of Silicon |
| Lecture 10 - Oxidation: Theory, Graphs |
| Lecture 11 - Oxidation: Graphs, Dopant Redistribution/ Film Deposition: Evaporation |
| Lecture 12 - Film Deposition: Sputtering, Chemical Vapor Deposition |
| Lecture 13 - Film Deposition: CVD, ALD/ Metal Electroplating/ Etching |
| Lecture 14 - Etching: Selectivity, Wet Etching, Dry Etching |
| Lecture 15 - Etching: Dry Etching, Chemical Mechanical Polishing/ Ion Implantation |
| Lecture 16 - Ion Implantation: The Basic Process, I/I Statistics, Junction Depth |
| Lecture 17 - Diffusion: Basic Process for Selective Doping |
| Lecture 18 - Diffusion: Predeposition, Diffusion Modeling |
| Lecture 19 - Diffusion: Successive Diffusions |
| Lecture 20 - Diffusion: Determining Junction Depth, Sheet Resistance, Measuring Resistance |
| Lecture 21 - Interconnects and Contacts |
| Lecture 22 - Interconnects and Contacts (cont.), CMOS Process |
| Lecture 23 - CMOS Process Flow, Metal MEMS, Advanced Isolation |
| Lecture 24 - Advanced Isolation (cont.), MOS CV |
| Lecture 25 - MOS CV, Vt Implant |
| Lecture 26 - Device Characterization |