EE C245/ME C218: Introduction to MEMS Design
EE C245/ME C218: Introduction to MEMS Design (Fall 2011, UC Berkeley). Taught by Professor Clark Tu-Cuong Nguyen, this course provides an introduction to physics, fabrication, and design of micro-electromechanical systems (MEMS).
Micro and nanofabrication processes, including silicon surface and bulk micromachining and non-silicon micromachining. Integration strategies and assembly processes. Microsensor and microactuator devices: electrostatic, piezoresistive,
piezoelectric, thermal, magnetic transduction. Electronic position-sensing circuits and electrical and mechanical noise. CAD for MEMS.
| Lecture 12 - Bulk Micromachining: Wafer Bonding, Mechanics of Materials for MEMS |
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| Time |
Lecture Chapters |
| [00:00:00] |
1. Bulk Micromachining: Wafer Bonding |
| [00:29:10] |
2. Mechanics of Materials for MEMS: Stress, Strain |
Go to the Course Home or watch other lectures:
| Lecture 01 - Admin & Overview, Introduction to MEMS |
| Lecture 02 - Benefits of Scaling I: GHz Micromechanical Resonators |
| Lecture 03 - Benefits of Scaling II: Chip-Scale Atomic Clocks, Thermal Circuits |
| Lecture 04 - Benefits of Scaling III: Thermal Circuits (cont.), Micro Gas Analyzers |
| Lecture 05 - Benefits of Scaling III (cont.), Fabrication Process Modules I: Oxidation, Film Deposition |
| Lecture 06 - Fabrication Process Modules II: Thin Film Deposition (cont.), Lithography |
| Lecture 07 - Fabrication Process Modules III: Lithography (cont.), Etching |
| Lecture 08 - Etching (cont.), Semiconductor Doping |
| Lecture 09 - Surface Micromachining |
| Lecture 10 - Surface Micromachining (cont.) |
| Lecture 11 |
| Lecture 12 - Bulk Micromachining: Wafer Bonding, Mechanics of Materials for MEMS |
| Lecture 13 - Mechanics of Materials for MEMS (cont.) |
| Lecture 14 - Beam Bending: Bending of Beams |
| Lecture 15 - Beam Bending: Stress Gradients in Cantilevers, Beam Combos |
| Lecture 16 - Beam Combos: Design Implications of Residual Stress and Stress Gradients |
| Lecture 17 |
| Lecture 18 - Energy Methods, Resonance Frequency |
| Lecture 19 - Resonance Frequency (cont.) |
| Lecture 20 - Equivalent Circuits, Capacitive Transducers |
| Lecture 21 - Capacitive Transducers: Energy Conserving Transducers |
| Lecture 22 - Capacitive Transducers: Parallel Plate Capacitive Transducers |
| Lecture 23 - Capacitive Transducers: Electrical Stiffness, Electrostatic Comb Drive |
| Lecture 24 - Equivalent Circuits II |
| Lecture 25 - Equivalent Circuits II (cont.), Gyroscopes |
| Lecture 26 - Gyroscopes and Sensing Circuits |
| Lecture 27 - Sensing Circuits |