EE C245/ME C218: Introduction to MEMS Design
EE C245/ME C218: Introduction to MEMS Design (Fall 2010, UC Berkeley). Instructor: Professor Clark Tu-Cuong Nguyen. This course provides an introduction to physics, fabrication, and design of micro-electromechanical systems (MEMS).
Micro and nanofabrication processes, including silicon surface and bulk micromachining and non-silicon micromachining. Integration strategies and assembly processes. Microsensor and microactuator devices: electrostatic, piezoresistive,
piezoelectric, thermal, magnetic transduction. Electronic position-sensing circuits and electrical and mechanical noise. CAD for MEMS.
| Lecture 06 - Fabrication Process Modules II: Thin Film Deposition (cont.), Lithography |
|
| Time |
Lecture Chapters |
| [00:00:00] |
1. Thin Film Deposition: Chemical Vapor Deposition (CVD) |
| [00:47:14] |
2. Thin Film Deposition: Atomic Layer Deposition (ALD) |
| [01:02:20] |
3. Thin Film Deposition: Electroplating |
| [01:07:50] |
4. Lithography |
Go to the Course Home or watch other lectures:
| Lecture 01 - Admin & Overview, MEMS Roadmaps |
| Lecture 02 - Benefits of Scaling I: GHz Micromechanical Resonators |
| Lecture 03 - Benefits of Scaling II: Chip-Scale Atomic Clocks, Thermal Circuits |
| Lecture 04 - Benefits of Scaling III: Thermal Circuits (cont.) |
| Lecture 05 - Benefits of Scaling III (cont.), Fabrication Process Modules I: Oxidation, Film Deposition |
| Lecture 06 - Fabrication Process Modules II: Thin Film Deposition (cont.), Lithography |
| Lecture 07 - Fabrication Process Modules III: Lithography (cont.), Etching |
| Lecture 08 - Semiconductor Doping, Surface Micromachining |
| Lecture 09 - Surface Micromachining (cont.) |
| Lecture 10 - Surface Micromachining (cont.) |
| Lecture 11 - Surface Micromachining (cont.), Bulk Micromachining |
| Lecture 12 - Bulk Micromachining (cont.), Mechanics of Materials for MEMS |
| Lecture 13 - Mechanics of Materials for MEMS (cont.) |
| Lecture 14 - Mechanics of Materials for MEMS (cont.), Beam Bending |
| Lecture 15 - Beam Bending (cont.), Stress Gradients in Cantilevers |
| Lecture 16 - Beam Combos: Folded-Flexure Suspensions (cont.) |
| Lecture 17 - Beam Combos (cont.), Energy Methods |
| Lecture 18 - Energy Methods (cont.) |
| Lecture 19 - Resonance Frequency |
| Lecture 20 - Equivalent Circuits, Capacitive Transducers |
| Lecture 21 - Capacitive Transducers (cont.) |
| Lecture 22 - Capacitive Transducers (cont.) |
| Lecture 23 - Capacitive Transducers (cont.), Equivalent Circuits |
| Lecture 24 - Equivalent Circuits (cont.) |
| Lecture 25 - Equivalent Circuits (cont.), Gyroscopes and Sensing Circuits |
| Lecture 26 - Sensing Circuits |